Screen printable substrates, 3-dimensional circuits
and molded interconnects combine multiple electronic
and mechanical functions in a single injection
molded part. Molded
interconnects are typically designed to efficiently
utilize the limited space in automotive, appliance,
hand held electronic and other applications.
CoolPoly thermally conductive plastics enhance the
performance of molded electronic substrates by
dissipating heat and reducing temperature in board
emitting diodes (LEDs) and other heat generating
surface mount components often require thermal
management to maintain the components at acceptable
operating temperatures. Board or substrate thermal
management is desirable as there are space or
function limitations that restrict use of add-on
items like heat sinks. Ceramic and metal core or
metal backed boards have been used to provide heat
transfer and a dielectric surface but have design
Additionally, heat transfer in metal core or metal
backed boards is often limited by the electrically
insulating layer on the surface.
thermally conductive plastics offer design freedom,
part consolidation, thermal management and
dielectric properties optimized for substrate use.
Standard methods for placing circuitry and mounting
components can be used. Additional mechanical or
heat transfer features are also easily incorporated
in the plastic part.
D5108 is used in the manufacture of molded
interconnects and substrates for surface mount