thermally conductive injection molding grade
thermoplastics are ideal encapsulants for
semiconductor and board level packaging. They offer
similar electrical, thermal and physical properties
to ceramics. Additionally, they are directly
overmolded on components or assemblies using high
volume, automated injection molding equipment to
form semiconductor packages.
Historically, semiconductor packaging has been
limited to ceramic and thermosetting polymers.
Direct encapsulation with thermally conductive
thermoplastics offers faster cycle time and
desirable dielectric properties. Enhanced heat
transfer in the application allows components to
operate at lower temperatures or achieve higher
powers without an increase in temperature.
is used for direct encapsulation via injection
molding of a variety of electronic components
including semiconductors, integrated circuits, power
converters, LEDs, and laser diodes.