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CoolPoly Material Solutions

CoolPoly® Thermally Conductive Plastics

For Substrates & Electronic Packaging

CoolPoly Benefits

CoolPoly thermally conductive injection molding grade thermoplastics are ideal low cost substitutes for ceramic substrates and other electronic packaging components. Historically, ceramics have been common electronic substrate materials due to a combination of dielectric properties and thermal conductivity. CoolPoly thermally conductive plastic has been shown in commercial applications to represent up to a 50% cost reduction versus an alumina substrate while providing equivalent heat transfer.

Net shape, 3-dimensional injection molding of thermally conductive plastics meets electronic packaging suppliers’ goals of miniaturization, integration and speed while significantly reducing the time, temperature, complexity and cost of the manufacturing process.

Thermally conductive plastics offer:

  • Low cost, excellent heat transfer

  • Design and manufacturing flexibility 

  • Similar dielectric, physical and thermal properties to alumina

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What's New

CoolPoly® Heat Sink Trends

Folded Fin Heatsinks

CoolPoly thermally conductive injection molding grade thermoplastics allow folded fin heat sinks designs with unique architectures and performance.

CoolPoly® Selection Tool

Not sure which material best suits your application?  Try our new CoolPoly selection tool.


Answers to the most commonly asked questions regarding thermally conductive polymers.

See Also

E-Series Datasheets

D-Series Datasheets

CoolPoly Selection Tool

Processing Guidelines


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