thermally conductive injection molding grade
thermoplastics are ideal low cost substitutes for
ceramic substrates and other electronic packaging
components. Historically, ceramics have been common
electronic substrate materials due to a combination
of dielectric properties and thermal conductivity.
thermally conductive plastic has been shown in
commercial applications to represent up to a 50%
cost reduction versus an alumina substrate while
providing equivalent heat transfer.
shape, 3-dimensional injection molding of thermally
conductive plastics meets electronic packaging
suppliers’ goals of miniaturization, integration and
speed while significantly reducing the time,
temperature, complexity and cost of the